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IEEE Transactions on Components Packaging and Manufacturing Technology


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*Average Peer Review
Ordinary, 3-6 Week(s)
*Competitiveness
Easy
CiteScore
4.7

CiteScore Rank
Subject Area Rank Percentile
Category: Engineering
Subcategory: Industrial and Manufacturing Engineering
123 / 384
Category: Engineering
Subcategory: Electrical and Electronic Engineering
283 / 797
Category: Engineering
Subcategory: Electronic, Optical and Magnetic Materials
108 / 284



Country/Area of Publication
UNITED STATES
Publication Frequency
Publisher
Institute of Electrical and Electronics Engineers Inc.

ISSN
2156-3950
E-ISSN
Year Publication Started
2011

Self-citation (2023-2024)
13.00%
Annual Article Volume
217
Gold OA Percentage
11.38%


Open Access Info
APC APC Waiver Other Charges
N/A N/A N/A

Journal Aim & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.


Web of Science Quartiles
WOS Quartile: Q2

Quartiles By JIFCollectionQuartileRankPercentage
Category: ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2175/352
Category: ENGINEERING, MANUFACTURINGSCIEQ341/68
Category: MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ3275/438
Quartiles By JCICollectionQuartileRankPercentage
Category: ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ3212/354
Category: ENGINEERING, MANUFACTURINGSCIEQ348/68
Category: MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ3267/438
*Crowdsourced data
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  • IEEE Transactions on Components Packaging and Manufacturing Technology IEEE Transactions on Components Packaging and Manufacturing Technology
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